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6 days ago
NXP Semiconductors·Semiconductors·6 days ago
6 days ago

BGA WB PRocess Techinician

Kuala Lumpur, MalaysiaMid · 2-5 years

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About this role

  • Perform machine setup, conversion, and qualification for wire bond equipment.
  • Monitor daily production performance and ensure compliance with process specifications.
  • Support production activities to achieve output, quality, and delivery targets.
  • Perform lot buy-off and process verification before production release.
  • Monitor critical wire bond parameters and maintain process stability.
  • Conduct routine process audits and inspections.
  • Perform process characterization and parameter optimization activities.
  • Analyze process data and identify trends affecting quality or yield.
  • Troubleshoot wire bond defects and supports engineers for root cause analysis
  • Support cost reduction and productivity enhancement initiatives.

#LI-DNI

SemiconductorsH1B sponsor likely
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