About this role
- New package technology and platform module development (Si-gel filled module).
- Technical leadership on new power module technology and enabling technology for automotive/industrial application.
- Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
- Package/design review for new package development, on-tme release with the first pass success (qualification).
- Present technical finding, design review and recommendation to stakeholders and management.
- Lead package related failure analysis, reliability testing and debug package issues.
- Participate in customer meeting, provide technical clarification and support failure investigation.
