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Job Purpose
· Flip Chip/ SMT/ Die bonding/ Ag Sintering Process Development for Power Module and Discrete with SiC, QFN with GaN
· New Process and Package Development for GaN, High Power Discrete and Module Package
· New Material Development for QFN, Discrete and Module
· Technical leader for related Process Development Activities communicating with Manufacturing,
BU and SLO
· Mentor of junior process development and package development engineers, technicians
and interns in Suzhou package development group for sintering process
· Support Process Development team under ATPDG
