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1 month ago
NXP Semiconductors·Semiconductors·1 month ago
1 month ago

Semiconductor Package Competitive Analysis Intern

Kuala Lumpur, MalaysiaInternshipEntry · 0-1 years

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About this role

Competitive Analysis Intern – Package Innovation

Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.

Key Responsibilities

  • Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
  • Develop insights on packaging trends, cost/performance positioning, and technology differentiation
  • Conduct startup and emerging technology evaluations relevant to advanced packaging
  • Consolidate findings into clear, executive-ready reports and dashboards for PI leadership
  • Maintain and enhance competitive analysis databases and tracking frameworks

Additional Exposure

  • Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes

Qualifications

  • Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
  • Strong analytical mindset with ability to synthesize large datasets into actionable insights
  • Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
  • Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
  • Strong communication skills with ability to clearly present findings


More information about NXP in Malaysia...

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SemiconductorsH1B sponsor likely
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