Job Details:
Job Description:
Delivers signal integrity solutions for large, complex highspeed platforms, boards, and packages. Develops a viable space for all interconnects including 2D and 3D models extracts of electrical structures for the entire dietodie interconnect. Defines signal integrity rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins. Applies knowledge of signal integrity design and tradeoffs to perform simulations of interconnect and guide package and platform physical implementation, and designs and characterizes test structures to correlate simulations and measurements for interconnects using intricate highspeed equipment and debugs challenges. Develops electrical specifications and new industry standard interconnect specifications to guide consortiums for nextgeneration interfaces. Documents and provides implementation guidelines to the end customers as part of the platform design guide. Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product landing zone requirements and minimize quality degradation (e.g., attenuation, crosstalk, jitter, power noise) and cost.
Qualifications:
Minimum Qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field.
- 8+ years of experience with a Bachelor's degree, 6+ years with a Master's degree, or 4 years with a PhD.
- Proficiency in signal integrity analysis, including simulations and validation techniques.
- Hands-on experience with 3D EM solvers and 3D modeling tools.
- Strong understanding of PCB and package design principles.
- Expertise in electrical validation and debug practices.
- Technical proficiency in noise glitch and signal/power integrity analysis.
Preferred Qualifications:
- Advanced knowledge of systems engineering fundamentals related to signal delivery design and evaluation.
- Familiarity with DDR and SERDES interfaces, such as LPDDR5x/6, GDDR6/7, PCIe Gen5/6/7, PAM-4 SerDes, UCIe, UAL, I3C, SVID, etc.
- Experience developing electrical interface specifications and collaborating with industry consortiums.
- Ability to demonstrate strong problem-solving skills and strategic thinking in design optimization.
- Proven ability to work collaboratively across multidisciplinary teams.
We are looking for passionate individuals eager to make an impact and drive innovation. If you are ready to redefine signal integrity engineering and be part of a team shaping the future of technology, we encourage you to apply today.
Job Type:
Experienced Hire
Shift:
Shift 1 (India)
Primary Location:
India, Bangalore
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
