Back to board
Texas Instruments·Semiconductors·19 days ago

焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer

Chengdu, People's Republic of ChinaMid · 2-5 yearsH1B likely

About this role

岗位职责: 
1. 兼顾Wire Bond(引线键合)工序工艺管控+设备运维全模块工作; 
2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改; 
3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升; 
4. 完成焊线工序新产品导入、工艺验证、工艺文件编制; 
5. 统筹焊线工序工艺和设备类问题闭环,推进产线标准化落地。