Advanced Packaging Intern, MS - Summer 2027
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What you'll do
- Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects.
- Evaluate package and PCB designs to ensure electrical performance requirements are met.
- Analyze power distribution networks (PDNs) and high-speed channels to identify and resolve signal and power delivery issues.
- Execute simulation and verification activities supporting SI/PI sign-off.
- Collaborate with package design, layout, hardware, and IP teams to optimize electrical performance.
- Develop scripts and automation tools using Python, MATLAB, or similar tools to improve analysis workflows.
- Document results and present technical findings to cross-functional engineering teams.
What they're looking for
- Currently enrolled in a Master's Degree program studying Electrical Engineering, Computer Engineering, or a related discipline, with an expected graduation date between Fall 2027 – Summer 2028.
- Strong interest in hardware design and strong understanding of electromagnetic fundamentals, signal integrity concepts and circuit simulation techniques.
- Knowledge of circuit simulation techniques and experience evaluating electrical behavior of package, PCB, or interconnect structures.
- Exposure to frequency-domain and time-domain analysis methodologies.
- Experience with electrical simulation tools for signal integrity, power integrity, or electromagnetic analysis.
- Ability to organize technical information, analyze data, document results, and communicate findings effectively.
- Strong collaboration skills and the ability to work with engineers across multiple disciplines, teams, and locations.
- Interest in hardware design, advanced packaging technologies, and design optimization.
Nice to have
- Experience evaluating package or PCB designs for challenging electrical requirements.
- Hands-on experience with 2-D/3-D electromagnetic simulation tools such as Ansys HFSS, SIwave, Cadence Clarity, or similar tools.
- Experience performing signal integrity (SI), power integrity (PI), channel analysis, power distribution network (PDN) analysis, or related simulation activities.
- Familiarity with advanced packaging technologies, including 2.5D and 3D packaging architectures.
- Experience collaborating with physical designers, layout engineers, or IP teams to optimize electrical performance.
- Familiarity with IC package design and layout tools such as Cadence APD or equivalent.
- Proficiency in MATLAB, Python, or other scripting languages for data analysis, automation, or workflow development.
- Strong presentation, documentation, and technical communication skills.
Summarised by NextRaise from the employer’s description, which follows in full below.
Full description from employer
About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world's leading manufacturers to solve our client's most challenging designs and integrations with industry-leading packaging techniques.What You Can Expect
Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects.
Evaluate package and PCB designs to ensure electrical performance requirements are met.
Analyze power distribution networks (PDNs) and high-speed channels to identify and resolve signal and power delivery issues.
Execute simulation and verification activities supporting SI/PI sign-off.
Collaborate with package design, layout, hardware, and IP teams to optimize electrical performance.
Develop scripts and automation tools using Python, MATLAB, or similar tools to improve analysis workflows.
Document results and present technical findings to cross-functional engineering teams.
What We're Looking For
The ideal candidate will have an interest in hardware design and experience working on signal and power integrity verification and design optimization. A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies is required.
Currently enrolled in a Master's Degree program studying Electrical Engineering, Computer Engineering, or a related discipline, with an expected graduation date between Fall 2027 – Summer 2028.
Strong interest in hardware design and strong understanding of electromagnetic fundamentals, signal integrity concepts and circuit simulation techniques.
Knowledge of circuit simulation techniques and experience evaluating electrical behavior of package, PCB, or interconnect structures.
Exposure to frequency-domain and time-domain analysis methodologies.
Experience with electrical simulation tools for signal integrity, power integrity, or electromagnetic analysis.
Ability to organize technical information, analyze data, document results, and communicate findings effectively.
Strong collaboration skills and the ability to work with engineers across multiple disciplines, teams, and locations.
Interest in hardware design, advanced packaging technologies, and design optimization.
Preferred Qualifications
Experience evaluating package or PCB designs for challenging electrical requirements.
Hands-on experience with 2-D/3-D electromagnetic simulation tools such as Ansys HFSS, SIwave, Cadence Clarity, or similar tools.
Experience performing signal integrity (SI), power integrity (PI), channel analysis, power distribution network (PDN) analysis, or related simulation activities.
Familiarity with advanced packaging technologies, including 2.5D and 3D packaging architectures.
Experience collaborating with physical designers, layout engineers, or IP teams to optimize electrical performance.
Familiarity with IC package design and layout tools such as Cadence APD or equivalent.
Proficiency in MATLAB, Python, or other scripting languages for data analysis, automation, or workflow development.
Strong presentation, documentation, and technical communication skills.
Expected Base Pay Range (USD)
37 - 73, $ per hour.The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.
Additional Compensation and Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights for our interns: medical, dental, and vision coverage, perks and discounts, robust mental health resources to prioritize emotional well-being, and paid holidays. Additional compensation may be available for intern PhD candidates. We look forward to sharing more with you during the interview process.All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
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