Boyd Thermal by Eaton Junior Thermal Research Engineer

Job Description

The Junior Thermal Research Engineer is responsible for supporting the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor test and aerospace and defense applications.

This role emphasizes thermal-fluid system modeling, data-driven engineering, and product development to accelerate design, optimization, and system-level performance prediction.

Job Description:

General Responsibilities:

The Junior Thermal Research Engineer will work within a multidisciplinary engineering team to develop innovative thermal management and test solutions for high-performance electronics and data center systems.

The role combines thermal system design, modeling, experimentation, and data science techniques, with a focus on enabling faster design cycles and improved system-level insight.

Primary Responsibilities:

• Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures
• Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)
• Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution
• Implement and use machine learning, AI and data-driven methods
• Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis
• Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models
• Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)
• Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities
• Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities
• Collaborate with senior engineers and researchers to:
  • Evaluate new cooling technologies
  • Improve system efficiency and performance
  • Identify key design tradeoffs
• Contribute to technical documentation, reports, and presentations of results

Additional Responsibilities:

• Support component and material selection for thermal systems (heat exchangers, sensors, cooling loops)
• Assist in manufacturing and assembly support, including prototype builds and testing
• Understand and evaluate trade-offs between cost, performance, and scalability
• Participate in cross-functional collaboration with mechanical, electrical, and controls engineers

Experience / Qualifications:

• Master’s or PhD degree in Mechanical Engineering or related field
• Focus or coursework in heat transfer, fluid dynamics, or thermal systems required
• Laboratory experience
• Graduate research experience in thermal-fluid sciences or cooling technologies strongly preferred

Technical Skills:

Thermal & Fluid Systems

• Two-phase cooling, electronics cooling, refrigeration/HVAC systems
• Heat exchanger design, boiling/condensation heat transfer

Modeling & Simulation

• ANSYS (Fluent, Icepak, Mechanical) or similar CFD tools
• System-level thermal-fluid modeling

Data Science & Optimization

• Machine learning surrogate modeling
• Data-driven engineering approaches

Programming

• Python and/or MATLAB for modeling, simulation, and data analysis
• LabVIEW

Experimental Methods

• DOE, instrumentation, DAQ, and experimental validation

Communications

• Strong communications skills to facilitate knowledge sharing

Preferred Experience:

• Exposure to data center cooling or high-performance electronics thermal management
• Experience developing reduced-order or surrogate models for thermal systems
• Familiarity with optimization-driven design workflows
• Experience integrating modeling and experimental validation

•  All positions require use of information or access to hardware which is subject to the International Traffic in Arms regulations. All applicants must be U.S. Persons within the meaning of ITAR. ITAR defines a U.S. Person as a U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

•  Eaton will not consider applicants for employment immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc.”  

•   Candidate will not need sponsorship now or in the future.

•  No relocation benefit is being offered for this position. Only candidates that currently reside within the immediate geographical area (50 miles/80 kilometers) of the {Location} facility will be considered. 

Additional Information:

• Travel may be required up to 10 % of the time
• Opportunity to gain exposure to and work with many cross functional teams
• Exposure to senior leaders within the Electrical Sector businesses – (leadership level/senior level roles only)

EEO EMPLOYER

All Job Posting Locations

Laconia

Remote Type

On-Site

EEO Statement

Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.