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TE
Tessolve·1 day ago
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Firmware Engineer (USB & OpenBMC) - REQ_2942

Bengaluru, IndiaFull-timeEntry · 1-5 yearsFirmware Engineer

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Must-have skills for this role

  • firmware
  • embedded c
  • openbmc
  • c++

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What you'll do

  • OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
  • Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
  • Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
  • OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
  • Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

What they're looking for

  • Expert embedded C, strong C++
  • BMC / platform-management firmware experience (OpenBMC strongly preferred)
  • DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
  • Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
  • RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
  • Yocto/BitBake, CMake/Meson, Git, CI
  • Understanding of I2C/SMBus, SPI, UART, USB, GPIO
  • Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics

Nice to have

  • OpenBMC strongly preferred

Summarised by NextRaise from the employer’s description, which follows in full below.

Full description from employer

Areas of Responsibility:

Skills: Firmware, Embedded C, C++, OpenBMC, OBMF-ICP, PLDM

  • OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
  • Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
  • Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
  • OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
  • Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

    Key Skills: OCP DC-SCM/DC-MHS, USB

Experience:
1 - 5 years of experience

  • Expert embedded C, strong C++
  • BMC / platform-management firmware experience (OpenBMC strongly preferred)
  • DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
  • Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
  • RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
  • Yocto/BitBake, CMake/Meson, Git, CI
  • Understanding of I2C/SMBus, SPI, UART, USB, GPIO
  • Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics

Company

TE
Tessolve
Bengaluru, India

Company facts come from this company's own listings. We only show what the postings themselves carry.

Sourced from Tessolve's careers site·first seen 23 Sept 2026·last verified 23 Sept 2026·How we source jobs

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