ON Semiconductor·11 days ago
11 days ago
Package Development Engineer
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What you'll do
- Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages.
- Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness.
- Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
What they're looking for
- Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages.
- Experience in package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness.
Summarised by NextRaise from the employer’s description, which follows in full below.
Full description from employer
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
Company
ON Semiconductor
San Jose, United States of America
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