MaxLinear·2 months ago
2 months ago
Senior IC Substrate Package Layout Designer
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About this role
Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages
Company
MaxLinear
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