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Jobs / RF Engineer in United States of America
5 days ago
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Kihomac·5 days ago
5 days ago

Senior Radio Frequency Engineer (Contingent)

Oklahoma City, United States of AmericaFull-timeSenior · 8+ yearsRF Engineer

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Must-have skills for this role

  • rf engineering
  • high power amplifier
  • circuit card assembly
  • bjt

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Apply faster with autofill FREEkihomac uses Workable - autofill it instead of retyping.careers.example.com/applyAutofillingFull namePriya SharmaEmailpriya.sharma@example.comPhone+49 30 1234567LocationBerlGet the extension

What you'll do

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

What they're looking for

  • Bachelor’s Degree in relevant engineering or science discipline required
  • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
  • Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
  • Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
  • Requirements engineering using MBSE tools (e.g., Cameo)
  • Authoring System/Subsystem Specifications and Interface Control Specifications
  • EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
  • Must be a US citizen
  • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire

Nice to have

  • Master’s degree preferred

Summarised by NextRaise from the employer’s description, which follows in full below.

Full description from employer

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

This position is contingent upon contract award.

Requirements

Education/Training: 

    • Bachelor’s Degree in relevant engineering or science discipline required  
    • Master’s degree preferred

Experience:

    • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
    • Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
    • Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
    • Requirements engineering using MBSE tools (e.g., Cameo)
    • Authoring System/Subsystem Specifications and Interface Control Specifications
    • EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810

Security:

    • Must be a US citizen
    • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire

Physical Requirements:

    • Able to occasionally reach with hands and arms
    • Prolonged periods of computer screen use, while sitting or standing at a desk
    • Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
    • Able to safely lift and carry up to 20 pounds at a time

Benefits

  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Life Insurance (Basic, Voluntary & AD&D)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Short Term & Long Term Disability
  • Training & Development
  • Wellness Resources

Salary: $135,000 - $150,000

Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.

Company

Kihomac
Oklahoma City, United States of America

Company facts come from this company's own listings. We only show what the postings themselves carry.

Sourced from Kihomac's careers site·first seen 17 Sept 2026·last verified 17 Sept 2026·How we source jobs

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