Hewlett Packard Enterprise·1 month ago
1 month ago
Senior Thermal/Hardware Engineer
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What you'll do
- Lead system-level thermal design and development for high-density, high-power networking platforms
- Oversee end-to-end thermal solutions
- Guide junior engineers
- Drive technical innovation
What they're looking for
- Deep expertise in thermal design and electronics packaging
- Experience in lead system-level thermal design and development for high-density, high-power networking platforms
Summarised by NextRaise from the employer’s description, which follows in full below.
Full description from employer
We are seeking a Senior Thermal/Hardware Engineer to lead system-level thermal design and development for high-density, high-power networking platforms. Oversee end-to-end thermal solutions, guide junior engineers, and drive technical innovation. Ideal for experienced professionals with deep expertise in thermal design and electronics packaging.
Skills
- thermal design
- electronics packaging
- cfd simulation
- heatsink design
- thermal feasibility studies
- design margin analysis
- cfd simulation tools (flotherm)
- thermal test automation
- python
- thermal test instrumentation
- thermal test setups
- data analysis
- sheet metal structure design
- plastic component design
- duct design
- baffle design
- fan control methodologies
- thermal control systems
- test automation scripting
- root cause analysis
- corrective actions
- technical leadership
- mentorship
- cross-functional collaboration
- project management
- design for manufacturability
- cost optimization
Company
Hewlett Packard Enterprise
Central Singapore, Singapore
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