SMTS Photonics Advanced Packaging Integration
Sign up free to see how well your resume matches this role.
What you'll do
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
- Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
- Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
- Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
- Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
- Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
- Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
- Present technical updates and roadmaps to internal stakeholders and external partners.
What they're looking for
- Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
- 5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
- Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
- Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
- Understanding of reliability standards and qualification methodologies for optical modules.
- Excellent analytical, problem-solving, and communication skills.
- Experience in bringing packaged products from development into production.
- Strong written and spoken English communication skills.
Nice to have
- Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
- Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
- Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
- Familiarity with GF’s Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
- Experience working with OSATs and managing external development partners.
- Demonstrated ability to lead cross-functional teams and influence technical direction.
Summarised by NextRaise from the employer’s description, which follows in full below.
Full description from employer
About GlobalFoundries:
- GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role:
- As a Photonic Packaging Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.
Essential Responsibilities:
- Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
- Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
- Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
- Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
- Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
- Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
- Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
- Present technical updates and roadmaps to internal stakeholders and external partners.
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications:
- Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
- 5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
- Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
- Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
- Understanding of reliability standards and qualification methodologies for optical modules.
- Excellent analytical, problem-solving, and communication skills.
- Experience in bringing packaged products from development into production.
- Strong written and spoken English communication skills.
Preferred Qualifications:
- Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
- Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
- Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
- Familiarity with GF’s Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
- Experience working with OSATs and managing external development partners.
- Demonstrated ability to lead cross-functional teams and influence technical direction.
Expected Salary Range
$107,400.00 - $204,500.00The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law
Company
Company facts come from this company's own listings. We only show what the postings themselves carry.