Tech Integration Engineer

Company Description

Absolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.

 

Position: Tech Integration Engineer

Location: COVINGTON, GA 

 

JOB SUMMARY 

The Tech Integration Engineer leads advanced packaging substrate integration from customer requirements through qualification and mass production. The role serves as the primary customer technical interface and owns cross-process gray-zone issues by aligning internal teams, identifying root causes, and driving timely resolution. Strong knowledge of advanced packaging and end-to-end substrate manufacturing is required. 

DUTIES/RESPONSIBILITIES: 

• Lead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production. 

• Serve as the primary customer technical interface and translate performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans. 

• Maintain end-to-end understanding of substrate processes, including material preparation, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final quality assurance. 

• Identify and resolve technical gray zones between process modules where ownership, specifications, or root causes are unclear. 

• Lead cross-process troubleshooting for yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues. 

• Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams to define ownership, containment, root cause, corrective actions, and closure timing. 

• Establish process-interface criteria, monitor technical risks and key performance indicators, and communicate status to customers and management. 

• Apply SPC, DOE, FMEA, and structured problem-solving methods to improve capability, yield, and reliability. 

  REQUIREMENTS: 

• Strong understanding of advanced packaging technologies and end-to-end glass or organic substrate manufacturing. 

• Ability to translate customer requirements into technical specifications, process flows, and qualification plans. 

• Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution. 

• Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment. 

• Strong communication, data analysis, and structured problem-solving skills. 

QUALIFICATIONS: 

• Demonstrated technical ownership, sound judgment, and ability to manage multiple priorities. 

• Effective cross-functional leadership, stakeholder alignment, mentoring, and executive communication skills. 

• Must be at least 18 years old and authorized to work in the United States. 

 

EDUCATION: 

• Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field; a master’s degree is preferred. 

 

EXPERIENCE:  

• Typically 7+ years of relevant engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development, including experience leading customer-facing or cross-functional technical programs. 

• Hands-on experience supporting technology qualification, new product introduction, manufacturing ramp, yield improvement, or high-volume production is strongly preferred. 

 

SALARY:

• $100,000 – $160,000

 

BENEFIT:

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• Cell phone allowance
• PTO and self-development
• Daily Lunch Benefit