External Package Innovation Engineer
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What you'll do
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site
- Provide Package Innovation (PI) input for: External site sourcing strategy, Site selection process (jointly with interface manager)
- Lead project governance, including: Overall project summaries, Stoplight reporting, Regular reviews per OSAT site
- Support NPI & NTI projects executed at external OSAT factories
- Ensure OSAT compliance with: Development processes, Required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT
- Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch
What they're looking for
- Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
Nice to have
- Previous exposure to OSAT ecosystem is an added advantage.
Summarised by NextRaise from the employer’s description, which follows in full below.
Full description from employer
Hiring: External Package Innovation Engineer
We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.
🔹 Role Overview
As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.
🔹 Key Responsibilities
✅ 1. Role Owner (Strategic & Governance)
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site
- Provide Package Innovation (PI) input for:
- External site sourcing strategy
- Site selection process (jointly with interface manager)
- Lead project governance, including:
- Overall project summaries
- Stoplight reporting
- Regular reviews per OSAT site
✅ 2. Supporter (Execution & Project Delivery)
- Support NPI & NTI projects executed at external OSAT factories
- Ensure OSAT compliance with:
- Development processes
- Required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT
- Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch
🔹 Stakeholder Collaboration
You will work closely with cross-functional teams, including:
- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners
🔹 What We’re Looking For
- Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
🌟 Why Join Us
- Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions
Company
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