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Jobs / Digital IC Design Engineer in United States of America
29 days ago
Hewlett Packard Enterprise·29 days ago
29 days ago

Principal Physical Design Engineer

Sunnyvale, United States of AmericaFull-timeSenior · 10-15 yearsDigital IC Design Engineer

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Must-have skills for this role

  • 7nm tapeout
  • rtl to gdsii
  • place and route
  • physical design

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About this role

Take on the role of Principal Physical Design Engineer, driving advanced ASIC design methodologies and automation. Lead the development and optimisation of P&R flows, collaborating with design teams to deliver high-performance silicon. Ideal for experienced engineers with deep expertise in Cadence Innovus, Synopsys Fusion Compiler, and modern RTL-to-GDS flows.

Skills

  • 7nm tapeout
  • python
  • eco generation
  • dft integration
  • power grid design
  • lvs/drc/erc/ant verification
  • perl
  • floorplan design
  • debugging
  • verilog
  • problem solving
  • rtl to gdsii
  • formal verification
  • 2.5d/3d packaging
  • place and route
  • collaboration
  • physical design
  • clock network design
  • tcl
  • linux shell scripting

Company

Hewlett Packard Enterprise
Sunnyvale, United States of America

Company facts come from this company's own listings. We only show what the postings themselves carry.

Sourced from Hewlett Packard Enterprise·first seen 31 Aug 2026·last verified 8 Sept 2026·How we source jobs

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