Mechanical Product Design Engineer, Platforms

Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power Google's services. Our computational challenges are unique, enabled by custom hardware designed and made in-house. Our Mechanical Product Design Engineering team members work cross-functionally to design, build, and deploy the latest technology to support the needs of compute, storage, networking, and machine learning hardware.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Responsibilities:

• Own and design entire product design life cycle, including requirements gathering, concept generation, detailed design with analysis, verification testing, cross-functional reviews, and manufacturing release.
• Develop and execute designs for systems backed by thorough engineering analysis.
  
• Create test plans, perform testing, and validate designs to meet engineering requirements.
• Troubleshoot, root cause, and resolve potential technical issues.
• Influence and shape future products by providing mechanical and product design engineering expertise into the technology roadmap with data-driven decisions. Identify and scope projects around innovation opportunities as well as technology risks.

Minimum qualifications:

• Bachelor's degree in Mechanical Engineering, Product Design, or a related field, or equivalent practical experience.
• 3 years of experience in mechanical engineering and design, including sheet metal, castings, injection molding, structural analysis, and thermal analysis.

Preferred qualifications:

• Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
  
• Experience in designing electro-mechanical assemblies with an understanding of mechanical tolerances from chip to data center scale, tolerance stackup analysis, quick connect/disconnect technologies and mechanisms.
• Experience developing products with high speed signal, power, and cooling interconnects.
• Experience in the mechanical design and engineering of high density, high component count PCBA assemblies.
• Knowledge of ASIC cooling solution stack-ups, their structural behavior, and reliability.